A 3D Split Manufacturing Approach to Trustworthy System Development
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Securing the supply chain of integrated circuits is of the utmost importance to computer security. In addition to counterfeit microelectronics, the theft or malicious modification of designs in the foundry can result in catastrophic damage to critical systems and large projects. In this Technical Report, we describe a 3D architecture that splits a design into two separate tiers: one tier that contains critical security functions is manufactured in a trusted foundry; another tier is manufactured in an unsecured foundry. We argue that a split manufacturing approach to hardware trust based on 3D integration is viable and provides several advantages over other approaches.
NPS Report NumberNPS-CS-12-004
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Elson, Jay F. (Monterey, California. Naval Postgraduate School, 2012-03);Military electronics rely on commodity processors, many of which are manufactured overseas where the trustworthiness of the foundries is uncertain. This thesis attempts to answer the question of whether common bus protocols ...
Huffmire, Ted; Levin, Timothy; Bilzor, Michael; Irvine, Cynthia E.; Valamehr, Jonathan; Tiwari, Mohit; Sherwood, Timothy; Kastner, Ryan (2010-10);3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductive posts. Since the dies may be manufactured ...
Huffmire, Ted; Kastner, Ryan; Sherwood, Tim; Irvine, Cynthia; Levin, Tim; Valamehr, Jonathan (2012);This project is investigating a novel approach to trustworthy system development based on 3D integration, an emerging chip fabrication technique in which two or more integrated circuit dies are combined into a single stack ...