Publication:
Computer Aided Thermal Analysis of a Microcircuit Structure

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Authors
Wilhelm, Joseph Arthur, Jr.
Subjects
Thermal Analysis
Computer Aided
Microcircuit Structure
Advisors
Kraus, Allan D.
Date of Issue
1990-12
Date
December 1990
Publisher
Monterey, California. Naval Postgraduate School
Language
en_US
Abstract
The Naval Post Graduate School has obtained software which can be used for the thermal analysis of an electronic component. This software includes two versions, one for steady state analysis and the other for transient analysis. Each version consists of two programs, a model builder and a thermal analyzer. This thesis describes a user friendly, menu driven specific model builder which may be used to rapidly generate a thermal model, containing up to 750 nodes, for a microcircuit die. This model builder is an improvement over the existing model builder in that the only pertinent input will be the physical dimensions and heat transfer data. The main feature of this model builder is the accommodation of the marked variation of silicon thermal conductivity with temperature.
Type
Thesis
Description
Series/Report No
Department
Department of Electrical and Computer Engineering
Other Units
Naval Postgraduate School (U.S.)
Identifiers
NPS Report Number
Sponsors
Funder
Format
iv, 60 p. ; 28 cm.
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.
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