Interface characterization of Cu-Cu and Cu-Ag-Cu low temperature solid state bonds.
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Authors
Dalbey, Robert Z.
Challenger, Kenneth D.
Subjects
Interface Characterization
Auger Spectroscopy
Solid State Bonding
Diffusion Bonding
Scanning Electron Microscopy
Auger Spectroscopy
Solid State Bonding
Diffusion Bonding
Scanning Electron Microscopy
Advisors
Challenger, Kenneth D.
Date of Issue
1987
Date
December 1987
Publisher
Language
en_US
Abstract
In this study, Auger Electron Spectroscopy (AES),
Scanning Electron Microscopy (SEM) and Energy Dispersive
X-ray (EDX) analysis have been used to characterize the
interface regions of copper to silver and copper to copper
bond samples in an effort to identify those parameters which
most affect the bond characteristics. Longitudinal and
transverse cross sections of the bond joint are examined.
Auger electron sputter depth profiling was used to examine
the interface properties and composition across the bond
interface. Depth profiles indicate carbon and oxygen
diffuse away from the interface during bonding facilitating
adhesion. Tensile tests on bonded samples indicate that
bond pressure has a more significant effect on bond strength
than temperature. A temperature threshold for bonding is
observed which is related to the ability of the bond
materials to scavenge their oxides. The difference in bond
strength/toughness for Cu-Cu bonds versus Cu-Ag-Cu bonds may
qualitatively indicate the magnitude of the chemical energy
term associated with joining these two dissimilar metals.
Type
Thesis
Description
Series/Report No
Department
Mechanical Engineering
Organization
Naval Postgraduate School
Identifiers
NPS Report Number
Sponsors
Funder
Format
52 p.
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.