The development of a thermal analysis model builder for a printed circuit board.

Abstract

The Naval Postgraduate School possesses software designed to perform thermal analysis of electronic components. At the core of this package is a model builder whose purpose is to generate a thermal model for use in steady state and transient thermal analyzers. The current version of the model builder requires excessive amounts of time for data input and model verification. This thesis describes the development of a model builder specifically designed to reduce the time required to model a printed circuit board containing up to four copper layers.