3D Security, 3Dsec: Trustworthy System Security through 3D Integrated Hardware [poster]
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Authors
Huffmire, Ted
Kastner, Ryan
Sherwood, Tim
Irvine, Cynthia
Levin, Tim
Valamehr, Jonathan
Subjects
3-D Integration and Security
Advisors
Date of Issue
2012
Date
28 November 2012.
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Language
Abstract
This project is investigating a novel approach to trustworthy system development based on 3D integration, an emerging chip fabrication technique in which two or more integrated circuit dies are combined into a single stack using vertical conductive posts. Since the dies may be manufactured separately, 3D circuit integration offers the option of enhancing a commodity processor with a variety of custom security functions, which are manufacturing options applicable only to those systems that require them. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems.
Type
Poster
Description
Poster, Wednesday Poster Session, NSF Secure and Trustworthy Cyberspace (SaTC) Principal Investigators Meeting, National Harbor, MD, 28 November 2012. [Poster] [Meeting] [Final Report]
Series/Report No
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Citation
Ted Huffmire, Ryan Kastner, Tim Sherwood, Cynthia Irvine, Tim Levin, and Jonathan Valamehr, 3D Security. Poster, Wednesday Poster Session, NSF Secure and Trustworthy Cyberspace (SaTC) Principal Investigators Meeting, National Harbor, MD, 28 November 2012.
Distribution Statement
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This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.