Calculation of surface binding energies by computer simulation of the sputtering process

Abstract

Sputtering of monocrystalline copper, a face-centered cubic, was investigated by computer simulation techniques using the Born-Mayer potential . Normally incident argon ions were shot into the (111), (110), and (100) orientations at various energies. Qualitatively correct deposit patterns were obtained for all orientations. Surface irregularities were found to play a significant role in the sputtering mechanism. Approximate values for the surface atom binding energy on the (111) and (110) orientations were 2.25 eV and 3.0 eV, respectively.