Publication:
Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM)

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Authors
Keebler, Henry C. III
Subjects
Upgraded logic module (ULM)
Thermal design
Electronic packaging
Advisors
Kelleher, Matthew
Date of Issue
1983-09
Date
September 1983
Publisher
Monterey, California. Naval Postgraduate School
Language
en_US
Abstract
The U.S. Army has developed an Upgraded Logic Module (ULM) for use in its Infantry Direct Fire Simulator System (IDFSS). It is designed to analyze data collected from associated instrumentation according to prescribed programming, to report results back to the system control via a telemetry interface, and it can be backpack mounted. The thermal environment existing at Ft. Hunter Liggett, Ca. (the primary operating environment for the ULM) during the summer will add an abnormal thermal load to the ULM operating environment in the backpack. A mock-up of the actual ULM was built to model the heat dissipation of all the components and tested in different environments using extreme power consumption rates. The actual ULM was tested with typical power consumption rates and various environmental temperatures, including solar loading. Under typical operating conditions, the ULM will remain within manufacturer's tolerances for individual component temperatures. However slight increases in power consumption rates will severely stress the reliability limits of certain components, and the reliability of the entire system cannot be predicted.
Type
Thesis
Description
Series/Report No
Department
Mechanical Engineering
Other Units
Naval Postgraduate School (U.S.)
Identifiers
NPS Report Number
Sponsors
Funder
Format
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.
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