Experimental study of solder/copper interface under varying strain rates

dc.contributor.advisorKwon, Young W.
dc.contributor.authorLuteran, Andrew M.
dc.contributor.corporateNaval Postgraduate School (U.S.)
dc.contributor.departmentMechanical and Aerospace Engineering (MAE)
dc.contributor.secondreaderDidoszak, Jarema M.
dc.date.accessioned2012-03-14T17:46:41Z
dc.date.available2012-03-14T17:46:41Z
dc.date.issued2011-03
dc.description.abstractThis thesis investigates the mechanical behavior of the copper-solder interface when subjected to dynamic axial loads at strain rates between 10.0 s-1 and 0.05 s-1. The copper is alloy 101 and the lead-free solder has a composition of 96% tin and 4% silver. The tests results revealed that as the strain rate increases so do the ultimate and yield strengths but the elastic modulus diminishes. When the specimens were heated to 65.5 degrees Celsius, the ultimate and yield strengths were significantly lower. Specimens were also tested at varying strain rates to compare and contrast the differences with the single strain rate data. Analysis of the fracture strain of the single and multiple strain rate tests revealed that the fracture strain from multiple-strain rate loadings fell between the fracture strains of the two singlestrain rates. From this observation, simple averaging could be utilized to predict the fracture strain when a coppersolder specimen was subjected to varying strain rates.en_US
dc.description.distributionstatementApproved for public release; distribution is unlimited.
dc.description.urihttp://archive.org/details/experimentalstud109455776
dc.format.extentxvi, 61 p. : col. ill. ;en_US
dc.identifier.oclc720366077
dc.identifier.urihttps://hdl.handle.net/10945/5776
dc.publisherMonterey, CA; Naval Postgraduate Schoolen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.en_US
dc.subject.lcshMechanical engineeringen_US
dc.subject.lcshCopperen_US
dc.titleExperimental study of solder/copper interface under varying strain ratesen_US
dc.typeThesisen_US
dspace.entity.typePublication
etd.verifiednoen_US
relation.isDepartmentOfPublicationfcd0a3e4-3370-4559-99ee-72c50043ad3c
relation.isDepartmentOfPublication.latestForDiscoveryfcd0a3e4-3370-4559-99ee-72c50043ad3c
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