Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

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Authors
Horton, W. Scott.
Subjects
Advisors
Dutta, Indranath
Date of Issue
2006-09
Date
Publisher
Monterey, California. Naval Postgraduate School
Language
Abstract
In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and demand improved resistance to creep and low-cycle fatigue in the solder joints. In this study the strengthening of these joints with two different reinforcements is explored: a hard particulate and a shape memory alloy (SMA) single fiber composite (SFC). A baseline is established with a SnAgCu solder that is then compared to test runs on the same solder matrix with Copper particles and then the SMA, Nickel- Titanium wire as reinforcements.
Type
Thesis
Description
Series/Report No
Department
Mechanical and Astronautical Engineering (MAE)
Organization
Naval Postgraduate School (U.S.).
Identifiers
NPS Report Number
Sponsors
Funder
Format
xiv, 59 p. : col. ill. ;
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
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