The thermal performance of air-cooled circuit boards used in standard electronic package designs
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Authors
Marto, Paul J.
Kelleher, Matthew D.
Subjects
Electronics cooling
liquid crystals
convection heat transfer
liquid crystals
convection heat transfer
Advisors
Date of Issue
1974-05
Date
Publisher
Monterey, CA; Naval Postgraduate School
Language
Abstract
A test section was designed and constructed to model air-cooled printed circuit boards containing integrated circuit components as proposed for Naval standard package designs. Thermal performance data are presented for air flow rates to 3.38 CFM across fiberglass/epoxy and aluminum core circuit boards, each containing nine resistor elements to simulate IC components. Hot spot areas on the boards are shown using both liquid crystals and thermocouple data. Results show that in designing such standard packages, care must be taken to avoid obstructions in the air flow path. These obstructions can cause poorly circulating flow regions near the circuit boards, leading to hot spots and poor thermal performance of the IC components. The use of an aluminum core circuit board can significantly reduce this hot spot problem.
Type
Technical Report
Description
Series/Report No
Department
Organization
Identifiers
NPS Report Number
NPS-59Mx74051
Sponsors
Naval Electronics Laboratory Center
Funding
WR-4-9072
Format
Citation
Distribution Statement
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.