RELIABILITY TESTING FOR GAN SEMICONDUCTOR DEVICES FOR HTOL APPLICATIONS
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Authors
Lee, Victor
Advisors
Weatherford, Todd R.
Second Readers
Porter, Matthew A.
Subjects
gallium nitride
wide bandgap semiconductors
high-power electronics
high temperature operating life
reliability testing
high current density
high temperature reverse bias
photo sensing
wide bandgap semiconductors
high-power electronics
high temperature operating life
reliability testing
high current density
high temperature reverse bias
photo sensing
Date of Issue
2024-03
Date
Publisher
Monterey, CA; Naval Postgraduate School
Language
Abstract
The U.S. Navy is starting to investigate the use of GaN semiconductor devices for high-power, high-current, and high-voltage applications. There is vested interest in powering new weapon systems using these devices. The goal of this research is to perform reliability testing for GaN semiconductor devices to test for degradation over long-term use at high temperatures, voltages, and currents. Degradation will be determined using photon emissions from the devices. The testing will be completed for both the forward and reverse bias cases. The goal is to determine how reliable the devices are, and what are the means by which they degrade over time.
Type
Thesis
Description
Series/Report No
Department
Electrical and Computer Engineering (ECE)
Organization
Identifiers
NPS Report Number
Sponsors
Office of Naval Research, Arlington, VA 22217
Funding
Format
Citation
Distribution Statement
Distribution Statement A. Approved for public release: Distribution is unlimited.
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.
