Superconducting characteristics of thin tin films in contact with copper films
Hannum, Charles Ray.
Wyatt, Raymond E.
MetadataShow full item record
Copper films of calculated thicknesses between 200 and 500° have been evaporated on tin films about 1000 and 2000° thick and the superconducting properties studied. In every case, the critical current for the coated specimen was reduced substantially from the value for an identical tin specimen without copper. In general, the critical current rises relatively slowly as the temperature is decreased. However, at temperatures around 3.0°K and just below 2.3°K, the critical current increases relatively sharply with reduction of temperature. For the thinnest copper coatings, there was no reduction of critical temperature, possibly because the copper film may not have been continuous. For the thicker coatings, the critical temperature of the specimens decreased monotonically with the thickness of the copper. The critical temperatures of the specimens as a function of reduced effective thickness of copper are approximated quite well by the formula
Showing items related by title, author, creator and subject.
Processing-microstructure-property relationships for cold spray powder deposition of Al-Cu alloys Leazer, Jeremy D. (Monterey, California: Naval Postgraduate School, 2015-06);This thesis presents research on the cold gas-dynamic spray process applied to the deposition of aluminum-copper alloy coatings. Cold spray deposition is a process utilized to create corrosion protection coatings and to ...
Electron paramagnetic resonance study of copper halide tetrazole complexes and the free radicals in irradiated strontium acetate hemihydrate Gisch, Robert Gary (Monterey, California. U.S. Naval Postgraduate School, 1969-06);An EPR study of copper halide tetrazole complexes and x-irradiated strontium acetate hemihydrate has been made. The powder spectra of some of the tetrazole complexes exhibited temperature dependent narrowing and broadening. ...
Interface characterization of Cu-Cu and Cu-Ag-Cu low temperature solid state bonds. Dalbey, Robert Z.; Challenger, Kenneth D. (1987);In this study, Auger Electron Spectroscopy (AES), Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray (EDX) analysis have been used to characterize the interface regions of copper to silver and copper to copper bond ...