Theses and Dissertations
Thermomechanical behavior of monolithic Sn-Ag-Cu solder and copper fiber reinforced solders
Processing of NITI reinforced adaptive solder for electronic packaging
An experimental approach for studying the creep behavior of thin film/ substrate interfaces
Sample fabrication and experimental design for studying interfacial creep at thin film/silicon interfaces
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Dutta, Indranath (4)
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Mechanical and Astronautical Engineering (4)
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