Theses and Dissertations
Processing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solder
(Monterey, California. Naval Postgraduate School, 2006-12)
of the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders ...
Thermo-mechanical response of monolithic and NiTi shape memory alloy fiber reinforced Sn-3.8Ag-0.7Cu solder
(Monterey, California. Naval Postgraduate School, 2005-09)
In electronic packaging, the reliability of solders is a critical issue, since serve as both electrical and mechanical connections. The most common failures arise from the thermo-mechanical fatigue (TMF) of solders, due ...
A first report on electromigration studies at a model copper-aluminum railgun contact
(Monterey, California. Naval Postgraduate School, 2006-12)
10A) was necessary to produce the large current densities typically found in railguns, and was able to simulate the skin effect on both the Cu rails and Al armature under static, long-term testing conditions. In this method, ...
Sample fabrication and experimental approach for studying interfacial sliding in thin film-substrate systems
(Monterey California. Naval Postgraduate School, 2006-09)
The purpose of this thesis was to develop an experimental methodology to determine the mechanisms and kinetics of sliding at the interface between a metallic thin film and substrate. A methodology was developed and used ...
Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder
(Monterey, California. Naval Postgraduate School, 2006-09)
In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of ...
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Dutta, Indranath (5)
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Mechanical and Astronautical Engineering (MAE) (5)
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