Thermal analysis and design of air cooled electronic circuit boards using a desktop computer.
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Authors
Foltz, Ricky Allen
Subjects
electronics cooling
interactive computer program
thermal network analysis
interactive computer program
thermal network analysis
Advisors
Kelleher, Matthew D.
Date of Issue
1980-06
Date
June 1980
Publisher
Monterey, California. Naval Postgraduate School
Language
en_US
Abstract
A thermal design procedure for air cooled electronic circuit boards has been developed for the Hewlett-Packard Model 9845 desktop computer. The system of interactive programs, called THERMELEX, performs thermal analysis of printed circuit boards to predict either the junction temperatures for given power dissipation levels or the maximum power levels for given junction temperature limits. The system includes the following features: totally interactive with all input in question and answer format, simple data verification and correction capabilities, ability to store and retrieve circuit board descriptive data totally under program control, wide variety of output formats including tabular and graphical. By using internal selection of heat transfer correlations, the THERMELEX system depends only on input of physical parameters for thermal predictions.
Type
Thesis
Description
Series/Report No
Department
Mechanical Engineering
Organization
Naval Postgraduate School (U.S.)
Identifiers
NPS Report Number
Sponsors
Funder
Format
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
Rights
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.