Thermo-mechanical response of monolithic and NiTi shape memory alloy fiber reinforced Sn-3.8Ag-0.7Cu solder
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Authors
Fountoukidis, Evangelos.
Subjects
Advisors
Dutta, Indranath
Date of Issue
2005-09
Date
Publisher
Monterey, CA; Naval Postgraduate School
Language
Abstract
In electronic packaging, the reliability of solders is a critical issue, since serve as both electrical and mechanical connections. The most common failures arise from the thermo-mechanical fatigue (TMF) of solders, due to mismatches in the coefficient of thermal expansion between the Si-chip and the printed circuit board. In order to meet the demands of miniaturization and enhanced performance in severe environments, a novel adaptive Tin-Silver-Copper (SnAgCu) solder reinforced with NiTi shape-memory alloy (particles or fiber) developed. An experimental apparatus has been designed to investigate the thermo-mechanical straincontrolled fatigue life of the solder during both single and multiple thermal cycling under double-shear loading. For comparison, thermo-mechanical single shear tests were also performed in monolithic Tin- Silver-Copper solder and in solder reinforced with Cu fiber. Also, micro-structural evaluation of the solders during the 5th cycle was possible using Scanning and Optical microcopy together with EDS analysis.
Type
Thesis
Description
Series/Report No
Department
Mechanical and Astronautical Engineering (MAE)
Organization
Naval Postgraduate School (U.S.)
Identifiers
NPS Report Number
Sponsors
Funder
Format
xiv, 73 p. : ill. ;
Citation
Distribution Statement
Approved for public release; distribution is unlimited.