Show simple item record

dc.contributor.advisorChallenger, Kenneth D.
dc.contributor.authorDalbey, Robert Z.
dc.contributor.authorChallenger, Kenneth D.
dc.dateDecember 1987
dc.date.accessioned2012-11-27T00:22:56Z
dc.date.available2012-11-27T00:22:56Z
dc.date.issued1987
dc.identifier.urihttp://hdl.handle.net/10945/22310
dc.descriptionApproved for public release; distribution is unlimiteden_US
dc.description.abstractIn this study, Auger Electron Spectroscopy (AES), Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray (EDX) analysis have been used to characterize the interface regions of copper to silver and copper to copper bond samples in an effort to identify those parameters which most affect the bond characteristics. Longitudinal and transverse cross sections of the bond joint are examined. Auger electron sputter depth profiling was used to examine the interface properties and composition across the bond interface. Depth profiles indicate carbon and oxygen diffuse away from the interface during bonding facilitating adhesion. Tensile tests on bonded samples indicate that bond pressure has a more significant effect on bond strength than temperature. A temperature threshold for bonding is observed which is related to the ability of the bond materials to scavenge their oxides. The difference in bond strength/toughness for Cu-Cu bonds versus Cu-Ag-Cu bonds may qualitatively indicate the magnitude of the chemical energy term associated with joining these two dissimilar metals.en_US
dc.description.urihttp://archive.org/details/interfacecharact00dalb
dc.format.extent52 p.en_US
dc.language.isoen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.en_US
dc.subject.lcshMechanical engineeringen_US
dc.titleInterface characterization of Cu-Cu and Cu-Ag-Cu low temperature solid state bonds.en_US
dc.typeThesisen_US
dc.contributor.corporateNaval Postgraduate School
dc.contributor.departmentMechanical Engineering
dc.subject.authorInterface Characterizationen_US
dc.subject.authorAuger Spectroscopyen_US
dc.subject.authorSolid State Bondingen_US
dc.subject.authorDiffusion Bondingen_US
dc.subject.authorScanning Electron Microscopyen_US
etd.thesisdegree.nameM.S. in Engineering Scienceen_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineEngineering Scienceen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record