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dc.contributor.advisorKelleher, Matthew Dennis
dc.contributor.authorPamuk, Turgay.
dc.contributor.authorKelleher, Matthew D.
dc.date.accessioned2012-11-27T00:23:24Z
dc.date.available2012-11-27T00:23:24Z
dc.date.issued1987
dc.identifier.urihttp://hdl.handle.net/10945/22377
dc.description.urihttp://archive.org/details/naturalconvectio00pamu
dc.format.extent70 p.en_US
dc.language.isoen_US
dc.subject.lcshMechanical engineeringen_US
dc.titleNatural convection immersion cooling of an array of simulated chips in an enclosure filled with dielectric liquid.en_US
dc.typeThesisen_US
dc.identifier.oclcocm640018203
etd.thesisdegree.nameM.S. in Mechanical Engineeringen_US
etd.thesisdegree.nameDegree of Mechanical Engineeren_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.levelProfessional Degreeen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.disciplineDegree of Mechanical Engineeren_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US


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