The prediction of the performance of a microcircuit heat sink in the boiling mode
Larkin, John W.
Kraus, Allan D.
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As microcircuit technology advances, there is an increased need for the dissipation of the heat which is generated. Extended surfaces are a useful toll in fulfilling the heat sink requirements for a microcircuit element. Heat transfer is very effective in the boiling mode and this thesis focuses on the analysis of a spine-shaped extended surface in a boiling liquid. Because the heat transfer in the spine and the propagation of signals on a transmission line are governed by identical differential equation, and analysis procedure based on the cascading of electrical transmission lines is used to predict the performance of the spine. The result of the analysis is a computer program that can assist the circuit designer in meeting any heat transfer requirements.
RightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.
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