Natural convection heat transfer studies of simulated and actual electronic components using dielectric liquids for immersion cooling
Thompson, Ronald G., Jr.
Kelleher, Matthew D.
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Two experimental studies of the natural convection characteristics of heated protrusions immersed in dielectric liquids were conducted. the first study used a three by three array of simulated 20 pin dual-in-line chips which were made from aluminum blocks with full heaters. The second set of experiments used a three by three array of thermal evaluation devices mounted on an alumina substrate. The devices were 8.9 mm square chips which contained resistors and a type of temperature sensing transistor. Both studies used an insulated Plexiglas enclosure with a top mounted heat exchanger maintained at a constant 10 degrees C. Each array was mounted on a Plexiglass substrate, and spacers were used to vary the horizontal distance from the components to the enclosure wall. Five separate enclosure widths were used, with a maximum spacing of 40 mm. The vertically oriented aluminum blocks were tested with FC-71 and power levels ranging from 0.115 W/chip to 2.9 W/chip. The non-dimensional data obtained was used to develop an empirical correlation which predicts Nusselt number as a function of Rayleigh number and enclosure width. The correlation was accurate to within 4% of the array averaged data, and the maximum uncertainty in the Nusselt number was 7.4%. The actual electronic components were tested with FC-71, FC-43 and FC-75. Power levels ranged from 0.34 W/chip to 1.48 W/chip. Again, the data obtained was used to develop a Nusselt number correlation. In this case a better correlation of the data was achieved using Grashof number and enclosure width. The correlation is accurate to within 2% of the array averaged data. The maximum Nusselt number uncertainty was 4.7%
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