Publication:
Processing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solder

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Authors
Chung, Koh Choon.
Subjects
Advisors
Dutta, Indranath
Date of Issue
2006-12
Date
Publisher
Monterey, California. Naval Postgraduate School
Language
Abstract
of the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders were characterized. The behavior of the solder joints during thermomechanical cycling was also characterized and the results showed that the shear stress induced in the composite solder joint is significantly reduced relative to that in the monolithic solder joint due to the generation of a back-stress associated with the B19Å fÅ *B2 phase transformation of the NiTi particles during the heating part of the cycle. This causes an appreciable reduction of the total inelastic strain range during cycling.
Type
Thesis
Description
Series/Report No
Department
Mechanical and Astronautical Engineering (MAE)
Other Units
Naval Postgraduate School (U.S.).
Identifiers
NPS Report Number
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Funder
Format
xiv, 57 p. : col. ill. ;
Citation
Distribution Statement
Approved for public release; distribution is unlimited.
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