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dc.contributor.advisorDutta, Indranath
dc.contributor.authorChung, Koh Choon.
dc.date.accessioned2012-03-14T17:35:26Z
dc.date.available2012-03-14T17:35:26Z
dc.date.issued2006-12
dc.identifier.urihttp://hdl.handle.net/10945/2521
dc.description.abstractof the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders were characterized. The behavior of the solder joints during thermomechanical cycling was also characterized and the results showed that the shear stress induced in the composite solder joint is significantly reduced relative to that in the monolithic solder joint due to the generation of a back-stress associated with the B19Å fÅ *B2 phase transformation of the NiTi particles during the heating part of the cycle. This causes an appreciable reduction of the total inelastic strain range during cycling.en_US
dc.description.urihttp://archive.org/details/processingndchar109452521
dc.format.extentxiv, 57 p. : col. ill. ;en_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.subject.lcshElectronicsen_US
dc.subject.lcshMechanicsen_US
dc.subject.lcshSilicon alloysen_US
dc.subject.lcshMechanical engineeringen_US
dc.subject.lcshTinen_US
dc.subject.lcshIndiumen_US
dc.titleProcessing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solderen_US
dc.typeThesisen_US
dc.contributor.corporateNaval Postgraduate School (U.S.).
dc.contributor.departmentMechanical and Astronautical Engineering (MAE)
dc.identifier.oclc80580886
etd.thesisdegree.nameM.S.en_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US
etd.verifiednoen_US
dc.description.distributionstatementApproved for public release; distribution is unlimited.


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