Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder
Horton, W. Scott.
MetadataShow full item record
In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and demand improved resistance to creep and low-cycle fatigue in the solder joints. In this study the strengthening of these joints with two different reinforcements is explored: a hard particulate and a shape memory alloy (SMA) single fiber composite (SFC). A baseline is established with a SnAgCu solder that is then compared to test runs on the same solder matrix with Copper particles and then the SMA, Nickel- Titanium wire as reinforcements.
Showing items related by title, author, creator and subject.
Chung, Koh Choon. (Monterey, California. Naval Postgraduate School, 2006-12);of the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders ...
Wood, Andrew Calvin (Monterey, California. Naval Postgraduate School, 2011-12);The objective of this research was to analyze the effects of impact loading on electronic component failure. A standard fiberglass composite printed circuit board (PCB) card was used in two impact tests. The first test ...
Cornejo, Orlando A. (Monterey, California. Naval Postgraduate School, 2007-09);Solder joints provide mechanical and electrical interconnections between electronic devices and packaging substrates in electronics applications. The different coefficient of thermal expansion (CTE) between substrate, ...