Sample fabrication and experimental approach for studying interfacial sliding in thin film-substrate systems
Burkhard, Michael A.
MetadataShow full item record
The purpose of this thesis was to develop an experimental methodology to determine the mechanisms and kinetics of sliding at the interface between a metallic thin film and substrate. A methodology was developed and used to study interfacial sliding of aluminum films on silicon substrates and copper films on fused quartz substrates. The methodology employed a lap shear type of geometry to load the interface between the film and substrate in shear. The results of the studies were inconclusive with regard to interfacial sliding. In the case of Al-Si, the sample fabrication process increased the interfacial amplitude to an extent that the sliding rate was essentially zero. In the case of Cu-Fused Quartz, chromium film was added to the sample to aid the adhesion of Cu to fused quartz and as a result reduced the sliding rate below detectable levels.
Showing items related by title, author, creator and subject.
Parks, Carl L. (Monterey, California. Naval Postgraduate School, 2004-09);Large shear stresses often develop at the interface between dissimilar materials in microelectronic devices, when they are subjected to thermo-mechanical excursions. These stresses can facilitate diffusionally accommodated ...
Sample fabrication and experimental design for studying interfacial creep at thin film/silicon interfaces Thornell, Mark E. (Monterey California. Naval Postgraduate School, 2004-03);This thesis developed the sample fabrication and experimental design for studying interfacial creep at thin film / Silicon interfaces. The specific interface of study was the crystalline interface created by Positive Vapor ...
Constant-Depth Scratch Test for the Quantification of Interfacial Shear Strength at Film-Substrate Interfaces Dutta, Indranath; Lascurain, David P. (The United States of America as represented by the Secretary of the Navy, Washington, DC (US), 1996-08-20);A Constant-Depth Scratch Test (CDST) technique to quantitatively determine the shear strength of interfaces between thin metallic or non-metallic films and metal or ceramic substrates is revealed. The test overcomes two ...