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dc.contributor.advisorDutta, Indranath
dc.contributor.authorBurkhard, Michael A.
dc.date.accessioned2012-03-14T17:35:56Z
dc.date.available2012-03-14T17:35:56Z
dc.date.issued2006-09
dc.identifier.urihttp://hdl.handle.net/10945/2681
dc.description.abstractThe purpose of this thesis was to develop an experimental methodology to determine the mechanisms and kinetics of sliding at the interface between a metallic thin film and substrate. A methodology was developed and used to study interfacial sliding of aluminum films on silicon substrates and copper films on fused quartz substrates. The methodology employed a lap shear type of geometry to load the interface between the film and substrate in shear. The results of the studies were inconclusive with regard to interfacial sliding. In the case of Al-Si, the sample fabrication process increased the interfacial amplitude to an extent that the sliding rate was essentially zero. In the case of Cu-Fused Quartz, chromium film was added to the sample to aid the adhesion of Cu to fused quartz and as a result reduced the sliding rate below detectable levels.en_US
dc.format.extentxiv, 53 p. : ill. (some col.) ;en_US
dc.publisherMonterey California. Naval Postgraduate Schoolen_US
dc.rightsApproved for public release, distribution unlimiteden_US
dc.subject.lcshMechanical engineeringen_US
dc.subject.lcshCopperen_US
dc.subject.lcshSiliconen_US
dc.subject.lcshChromiumen_US
dc.subject.lcshMethodologyen_US
dc.subject.lcshQuartzen_US
dc.subject.lcshAluminumen_US
dc.titleSample fabrication and experimental approach for studying interfacial sliding in thin film-substrate systemsen_US
dc.typeThesisen_US
dc.contributor.corporateNaval Postgraduate School (U.S.).
dc.contributor.departmentMechanical and Astronautical Engineering (MAE)
dc.identifier.oclc72595989
etd.thesisdegree.nameM.S.en_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US
etd.verifiednoen_US


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