Calculation of chip temperatures using ELLPACK
van Joolen, Vincent J.
Franke, Richard H.
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In this thesis we report on an experiment to solve a three dimensional elliptic problem using ELLPACK software. The physical problem arises when calculating the distribution of temperatures within an electronic package in order to assist in the design of appropriate cooling. ELLPACK software is modified here to solve three dimensional problems more general than the ones it was originally designed for. ELLPACK, Heat transfer interfaces
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