Process-dependence of properties in high thermal conductivity aluminum nitride substrates for electronic packaging.
Cooper, John H.
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The development of secondary phases due to the presence of Y2O3 additions during sintering of Aluminum Nitride was studied. Depending on the amount of Y2O3 added, two non-equilibrium phases (cubic YAIO3 and orthorhombic AIYO3) were found to be present at room temperature, in addition to equilibrium AI5Y3O12 and AI2Y4O9. Sintering at increasing temperatures was found to alter the proportions of the above phases. This appreciably affected physical properties and mechanical properties like density, stiffness, strain to fracture, and failure morphology. These changes were rationalized on the basis of the microstructural effects of sintering. TEM studies were also conducted to investigate the evolution of bulk and surface defects in sintered AIN during processing. In the low Y2O3 containing samples, heat treatment at 1850°C resulted in a 2 phase mixture of Y-aluminate and 7-AI2O3 at the triple grain boundaries in AIN. Based on these results, a mechanism for the sintering process is proposed.
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