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dc.contributor.advisorDutta, Indranath
dc.contributor.authorMartin, Raymond W.
dc.dateSeptember 1991
dc.date.accessioned2013-02-15T23:34:05Z
dc.date.available2013-02-15T23:34:05Z
dc.date.issued1991-09
dc.identifier.urihttp://hdl.handle.net/10945/28569
dc.descriptionApproved for public release; distribution is unlimiteden_US
dc.description.abstractThe metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the intermetallic compound. An experimental apparatus for the immersion-emersion tensiometric method, which can be used to determine immersion and emersion contact angles and surface tension, was set up and tested. This technique offers several advantages over the conventional sessile drop and tensiometric methods, and can be utilized ti study wettability at liquid-solid interfaces.en_US
dc.description.urihttp://archive.org/details/studiesofinterme00mart
dc.format.extent74 p.en_US
dc.language.isoen_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. As such, it is in the public domain, and under the provisions of Title 17, United States Code, Section 105, may not be copyrighted.en_US
dc.titleStudies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfacesen_US
dc.typeThesisen_US
dc.contributor.corporateNaval Postgraduate School
dc.contributor.departmentMechanical Engineering
dc.subject.authorCu-Pb solderen_US
dc.subject.authorWettabilityen_US
dc.subject.authorImmersion-emersion techniqueen_US
dc.description.serviceLieutenant, United States Coast Guarden_US
etd.thesisdegree.nameM.S. in Mechanical Engineeringen_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US


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