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dc.contributor.advisorSathe, Sanjeev
dc.contributor.advisorJoshi, Yogendra
dc.contributor.authorHaukenes, Larry Olaf
dc.dateJune 1990
dc.date.accessioned2013-04-11T22:14:49Z
dc.date.available2013-04-11T22:14:49Z
dc.date.issued1990-06
dc.identifier.urihttp://hdl.handle.net/10945/30645
dc.descriptionApproved for public release, distribution is unlimiteden_US
dc.description.abstractA numerical investigation of two-dimensional natural convection flow and heat transfer from a substrate-mounted flush heat source immersed in a liquid-filled square enclosure was conducted. The study is relevant to direct liquid-immersion cooling of electronic-components. A control volume based finite-difference model that accounts for conduction heat transfer within the substrate and heat source and the coupled natural convection in the fluid was utilized. Numerical predictions were obtained for a wide range of Rayleigh and Prandtl numbers, substrate to fluid and heat source to fluid thermal conductivity ratios and other geometrical parameters that may be encountered in practice. An increase in Rayleigh number lead to more vigorous flow and promoted cooling. No noticeable effect on the nondimensional temperature was observed when changing the Prandt number from 7 to 100. Little reduction in maximum temperatures was observed when substrate and component to fluid thermal conductivity ratios were increased beyond 10 and 25, respectively. Component to substrate width ratio change from .25 to .999 resulted in approximately linear decrease in the maximum temperature. A companion experimental study of three- dimensional natural convection transport from a flush mounted array of heat sources in water was also conducted. Computer temperatures compared favorably to appropriate experimental data.en_US
dc.format.extentix, 135 p. ; ill.en_US
dc.language.isoen_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. As such, it is in the public domain, and under the provisions of Title 17, United States Code, Section 105, may not be copyrighted.en_US
dc.subject.lcshHeat,Transmissionen_US
dc.subject.lcshFluid mechanics.en_US
dc.titleA computational and experimental study of flush heat sources in liquidsen_US
dc.typeThesisen_US
dc.contributor.corporateNaval Postgraduate School (U.S.)
dc.contributor.departmentDepartment of Mechanical Engineering
dc.subject.authorElectronic Coolingen_US
dc.subject.authorLiquid Immersionen_US
dc.subject.authorNatural Convectionen_US
dc.subject.authorNumerical Heat Transferen_US
dc.description.serviceLieutenant, United States Navyen_US
etd.thesisdegree.nameM.S. in Mechanical Engineering and Degree of Mechanical Engineeren_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.levelProfessional Degreeen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.disciplineMechanical Engineeren_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US


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