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dc.contributor.advisorKelleher, Matthew
dc.contributor.advisorPhelan, Pat E
dc.contributor.authorMagee, Michael P.
dc.dateDecember, 1996
dc.date.accessioned2013-04-30T22:04:21Z
dc.date.available2013-04-30T22:04:21Z
dc.date.issued1996-12
dc.identifier.urihttp://hdl.handle.net/10945/32006
dc.description.abstractThe thermal boundary resistance between a YBa2Cu3O7 thin film and an MgO substrate was measured under conditions of varying heat flux. Heat flux was varied in a manner to explore any hysteresis effects present. It was concluded that hysteresis effects are present and are most likely attributed to changes in the peeling or compressive stresses in the thin-film. The changes in the peeling stresses may not be fully relieved after cycling of the heat flux or may have caused microstructural changes near the interface resulting in changes in microscale heat transfer characteristics. Additionally, finite difference method were used to model the physical situation. It was found that boundary resistance values generated by the computer program were several orders of magnitude less than experimental value. It was concluded that finer meshes must be used in order to increase the accuracy of the results. It was recommended that the modeling be redone on a main frame computer using finite element methods.en_US
dc.description.urihttp://archive.org/details/thermalboundaryr1094532006
dc.format.extentix, 77 p.en_US
dc.language.isoen_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.titleThermal boundary resistance in a high temperature thin-film superconductor under varying heat fluxen_US
dc.typeThesisen_US
dc.description.recognitionNAen_US
dc.description.serviceU.S. Navy (U.S.N.) authoren_US
etd.thesisdegree.nameM.S. in Mechanical Engineeringen_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US
dc.description.distributionstatementApproved for public release; distribution is unlimited.


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