Hardware Trust Implications of 3-D Integration

Author
Huffmire, Ted
Levin, Timothy
Bilzor, Michael
Irvine, Cynthia E.
Valamehr, Jonathan
Tiwari, Mohit
Sherwood, Timothy
Kastner, Ryan
Date
2010-10Metadata
Show full item recordAbstract
3-D circuit-level integration is a chip fabrication technique
in which two or more dies are stacked and combined into
a single circuit through the use of vertical electroconductive
posts. Since the dies may be manufactured separately, 3-D
circuit integration offers the option of enhancing a commodity
processor with a variety of security functions. This paper
examines the 3-D design approach and provides an analysis
concluding that the commodity die system need not be independently
trustworthy for the system of joined dies to provide
certain trustworthy functions. In addition to describing
the range of possible security enhancements (such as cryptographic
services), we describe the ways in which multiple-die
subsystems can depend on each other, and a set of processing
abstractions and general design constraints with examples to
address these dependencies.
Description
Proceedings of the 5th Workshop on Embedded Systems Security (WESS), Scottsdale, AZ, October 2010, Pages 1-10. [Paper] [Workshop] [Slides]