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dc.contributor.advisorDutta, Indranath
dc.contributor.authorAnastasio, Onofrio A.
dc.date.accessioned2012-03-14T17:46:07Z
dc.date.available2012-03-14T17:46:07Z
dc.date.issued2002-06
dc.identifier.urihttp://hdl.handle.net/10945/5620
dc.descriptionApproved for public release; distribution is unlimiteden_US
dc.description.abstractCurrently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long time, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed and constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of Å 0.1N, and a displacement resolution of 0.05mm with a stability of Å 0.1mm. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than fine microstructures in the tested regime.en_US
dc.format.extentxvi, 39 p. : ill. (some col.) ;en_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. As such, it is in the public domain, and under the provisions of Title 17, United States Code, Section 105, may not be copyrighted.en_US
dc.subject.lcshMetalsen_US
dc.subject.lcshCreepen_US
dc.subject.lcshSolder and solderingen_US
dc.subject.lcshMicroelectronicsen_US
dc.titleAn approach for impression creep of lead-free microelectronic soldersen_US
dc.typeThesisen_US
dc.subject.authorImpression creepen_US
dc.subject.authorLead-free soldersen_US
dc.description.serviceLieutenantCoriimander, United StatesNavyen_US
etd.thesisdegree.nameM.S. in Mechanical Engineeringen_US
etd.thesisdegree.levelMastersen_US
etd.thesisdegree.disciplineMechanical Engineeringen_US
etd.thesisdegree.grantorNaval Postgraduate Schoolen_US


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