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dc.contributor.advisorKwon, Young W.
dc.contributor.authorLuteran, Andrew M.
dc.date.accessioned2012-03-14T17:46:41Z
dc.date.available2012-03-14T17:46:41Z
dc.date.issued2011-03
dc.identifier.urihttp://hdl.handle.net/10945/5776
dc.descriptionApproved for public release; distribution is unlimited.en_US
dc.description.abstractThis thesis investigates the mechanical behavior of the copper-solder interface when subjected to dynamic axial loads at strain rates between 10.0 s-1 and 0.05 s-1. The copper is alloy 101 and the lead-free solder has a composition of 96% tin and 4% silver. The tests results revealed that as the strain rate increases so do the ultimate and yield strengths but the elastic modulus diminishes. When the specimens were heated to 65.5 degrees Celsius, the ultimate and yield strengths were significantly lower. Specimens were also tested at varying strain rates to compare and contrast the differences with the single strain rate data. Analysis of the fracture strain of the single and multiple strain rate tests revealed that the fracture strain from multiple-strain rate loadings fell between the fracture strains of the two singlestrain rates. From this observation, simple averaging could be utilized to predict the fracture strain when a coppersolder specimen was subjected to varying strain rates.en_US
dc.description.urihttp://archive.org/details/experimentalstud109455776
dc.format.extentxvi, 61 p. : col. ill. ;en_US
dc.publisherMonterey, California. Naval Postgraduate Schoolen_US
dc.rightsThis publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. As such, it is in the public domain, and under the provisions of Title 17, United States Code, Section 105, may not be copyrighted.en_US
dc.subject.lcshMechanical engineeringen_US
dc.subject.lcshCopperen_US
dc.titleExperimental study of solder/copper interface under varying strain ratesen_US
dc.typeThesisen_US
dc.contributor.secondreaderDidoszak, Jarema M.
dc.contributor.corporateNaval Postgraduate School (U.S.).
dc.contributor.departmentMechanical and Aerospace Engineering (MAE)
dc.identifier.oclc720366077
etd.verifiednoen_US


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