Surface Modification of Synthetic Diamond for Producing Adherent Thick and Thin Film Etallizations for Electronic Packaging
Abstract
An article and a method of making surface modified synthetic
diamond substrates at temperatures below 5000 C. for
electronic packaging applications are described. The article
consists of a synthetic diamond substrate, the surface of
which has been modified by providing an adherent thin
coating of a ceramic (alumina) material so as to enable
metallization of synthetic diamond by current industrial
methods. The method of surface modification comprises
deposition of a thin transition metal layer on the synthetic
diamond substrate prior to low temperature reactive vapor
deposition of aluminum followed by annealing in an oxygen
atmosphere.
Description
Patent
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This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.Collections
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