Surface Modification of Synthetic Diamond for Producing Adherent Thick and Thin Film Etallizations for Electronic Packaging

Abstract

An article and a method of making surface modified synthetic diamond substrates at temperatures below 5000 C. for electronic packaging applications are described. The article consists of a synthetic diamond substrate, the surface of which has been modified by providing an adherent thin coating of a ceramic (alumina) material so as to enable metallization of synthetic diamond by current industrial methods. The method of surface modification comprises deposition of a thin transition metal layer on the synthetic diamond substrate prior to low temperature reactive vapor deposition of aluminum followed by annealing in an oxygen atmosphere.