An experimental approach for studying creep behavior of model planar interfaces
Peterson, Keith A.
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An apparatus for measuring the steady state creep behavior of interfaces in aluminum-silicon-aluminum multilayered specimens has been assembled. In the experiment scheme, a double-shear specimen geometry was used to load the interfaces in a state of nominally constant shear. The deformation kinetics for interfacial sliding during constant shear stress creep experiments were measured for various applied interfacial shear Stress levels and temperatures. Interfacial shear strain rates were measured using displacement and capacitance gauges. The planar interfaces between the aluminum and silicon layers were prepared by diffusion bonding. Preliminary results indicate that that interfacial sliding occurs via time-dependent relaxation mechanisms and that there is a threshold stress for interfacial sliding, in agreement with previous work on lead-Quartz and lead- nickel interfaces
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Farsaris, Ioannis (Monterey, California. Naval Postgraduate School, 1999-12-01);There has been considerable recent interest in interfacial sliding during creep of multi-phase materials. The effect of interfacial creep is crucial for the deformation of metal-matrix composites and thin film systems, ...
Peterson, Keith A. (Monterey, California. Naval Postgraduate School, 2002., 2002-09);In many applications, large shear stresses develop at interfaces between dissimilar materials during thermo-mechanical excursions, when there is a significant difference in the coefficient of thermal expansion between them. ...
Campbell, John C. (Monterey, California. Naval Postgraduate School, 1994-12);By using a constant depth scratch test, the interfaces shear strength of various thin film/substrate interfaces can be determined. The ability to quantitatively ascertain when thin film debonding occurs has become especially ...