Theses and Dissertations
Aging effects on microstructure and creep in Sn-3.8Ag-0.7Cu solder
Electromigration related effects at metal-metal interfaces application to railguns
Processing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solder
A first report on electromigration studies at a model copper-aluminum railgun contact
Sample fabrication and experimental approach for studying interfacial sliding in thin film-substrate systems
Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder
Thermomechanical behavior of monolithic Sn-Ag-Cu solder and copper fiber reinforced solders
Thermo-mechanical response of monolithic and NiTi shape memory alloy fiber reinforced Sn-3.8Ag-0.7Cu solder
An experimental approach for studying the creep behavior of thin film/ substrate interfaces
Processing of NITI reinforced adaptive solder for electronic packaging
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Dutta, Indranath (39)
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Mechanical Engineering (39)